2024
Designing membranes with specific binding sites for selective ion separations
Violet C, Ball A, Heiranian M, Villalobos L, Zhang J, Uralcan B, Kulik H, Haji-Akbari A, Elimelech M. Designing membranes with specific binding sites for selective ion separations. Nature Water 2024, 2: 706-718. DOI: 10.1038/s44221-024-00279-6.Peer-Reviewed Original ResearchMembrane nanochannelsFunctional groupsCovalent organic frameworksMetal-organic frameworksSelective ion separationIon binding energiesMembrane material designSelective ion transportIon binding affinityEnergy storage technologiesOrganic frameworksIon separationSynthetic methodNanostructured materialsBinding sitesBinding energyMaterial designDesign membranesDrug discoveryAngstrom scaleChemical interactionIonsChemical featuresNanochannelsIon transport
2019
Filament Nucleation Tunes Mechanical Memory in Active Polymer Networks
Yadav V, Banerjee D, Tabatabai A, Kovar D, Kim T, Banerjee S, Murrell M. Filament Nucleation Tunes Mechanical Memory in Active Polymer Networks. Advanced Functional Materials 2019, 29 PMID: 32523502, PMCID: PMC7286550, DOI: 10.1002/adfm.201905243.Peer-Reviewed Original ResearchPolymer networksShape memoryIsotropic materialsActive materialMaterial designMaterial functionalityLow nucleationChemical timescalesMembrane surfaceNucleationMechanical memoryEnergyMaterialsCritical nucleationFilament curvatureInternal energyDissipationDense networkTopological defectsGrand challenge
2018
Three-dimensional integrated stretchable electronics
Huang Z, Hao Y, Li Y, Hu H, Wang C, Nomoto A, Pan T, Gu Y, Chen Y, Zhang T, Li W, Lei Y, Kim N, Wang C, Zhang L, Ward J, Maralani A, Li X, Durstock M, Pisano A, Lin Y, Xu S. Three-dimensional integrated stretchable electronics. Nature Electronics 2018, 1: 473-480. DOI: 10.1038/s41928-018-0116-y.Peer-Reviewed Original ResearchStretchable electronicsConventional single-layer designStretchable human-machine interfaceSoft electronic systemsVertical interconnect accessSingle-layer designMaterial processing capabilitiesHigh integration densityThree-dimensional devicesSingle-layer approachControl solderStretchable configurationsStretchable circuitsStretchable substratesHuman-machine interfaceData communication capabilityMaterial designAdvanced microfabricationIntegration densityDynamic surfaceCommunication capabilitiesProcessing capabilitiesEngineering frameworkElectronic systemsDesign
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