Three-dimensional integrated stretchable electronics
Huang Z, Hao Y, Li Y, Hu H, Wang C, Nomoto A, Pan T, Gu Y, Chen Y, Zhang T, Li W, Lei Y, Kim N, Wang C, Zhang L, Ward J, Maralani A, Li X, Durstock M, Pisano A, Lin Y, Xu S. Three-dimensional integrated stretchable electronics. Nature Electronics 2018, 1: 473-480. DOI: 10.1038/s41928-018-0116-y.Peer-Reviewed Original ResearchStretchable electronicsConventional single-layer designStretchable human-machine interfaceSoft electronic systemsVertical interconnect accessSingle-layer designMaterial processing capabilitiesHigh integration densityThree-dimensional devicesSingle-layer approachControl solderStretchable configurationsStretchable circuitsStretchable substratesHuman-machine interfaceData communication capabilityMaterial designAdvanced microfabricationIntegration densityDynamic surfaceCommunication capabilitiesProcessing capabilitiesEngineering frameworkElectronic systemsDesign
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