2017
Reliability enhancement of Sn-1.0Ag-0.5Cu nano-composite solders by adding multiple sizes of TiO2 nanoparticles
Wen Y, Zhao X, Chen Z, Gu Y, Wang Y, Chen Z, Wang X. Reliability enhancement of Sn-1.0Ag-0.5Cu nano-composite solders by adding multiple sizes of TiO2 nanoparticles. Journal Of Alloys And Compounds 2017, 696: 799-807. DOI: 10.1016/j.jallcom.2016.12.037.Peer-Reviewed Original ResearchNano‐composite solder jointsNano-composite soldersSolder jointsTiO2 nanoparticlesThermal cyclingShear strengthCoefficient of thermal expansion reductionInterfacial intermetallic compound growthSize of TiO2 nanoparticlesComposite solder alloysSAC105 solder jointsCoefficient of thermal expansionShear strength enhancementIntermetallic compound growthInterfacial intermetallic compound formationElectrical resistance changeIntermetallic compound formationMicrostructural refinementStrength enhancementDecreased CTESolder alloysElectrical reliabilitySolderReliability enhancementTiO2
2015
Effects of nano-SiO2 particles addition on the microstructure, wettability, joint shear force and the interfacial IMC growth of Sn3.0Ag0.5Cu solder
Wang Y, Zhao X, Xie X, Gu Y, Liu Y. Effects of nano-SiO2 particles addition on the microstructure, wettability, joint shear force and the interfacial IMC growth of Sn3.0Ag0.5Cu solder. Journal Of Materials Science: Materials In Electronics 2015, 26: 9387-9395. DOI: 10.1007/s10854-015-3151-8.Peer-Reviewed Original ResearchInterfacial intermetallic compoundsJoint shear forceNano-SiO2 particlesSiO2 nanoparticlesNano-SiO2Composite solderShear forceInterfacial IMCsThermal cyclingGrowth of interfacial intermetallic compoundsComposite solder jointsInterfacial IMCs formationNano-composite soldersConcentration of SiO2 nanoparticlesInterfacial IMC layerInterfacial IMC growthEffect of SiO2Solder jointsIMC layerSolder alloysHigh shear forcesIMC formationParticle additionOptimum additive concentrationWorking temperatureEffects of Cobalt Nanoparticles Addition on Shear Strength, Wettability and Interfacial Intermetallic Growth of Sn−3.0Ag−0.5Cu Solder during Thermal Cycling
Gu Y, Liu Y, Zhao X, Wen S, Li H, Wang Y. Effects of Cobalt Nanoparticles Addition on Shear Strength, Wettability and Interfacial Intermetallic Growth of Sn−3.0Ag−0.5Cu Solder during Thermal Cycling. Materials Science Forum 2015, 815: 97-102. DOI: 10.4028/www.scientific.net/msf.815.97.Peer-Reviewed Original ResearchShear strengthInterfacial intermetallic compoundsCo nanoparticlesNanoparticle additionIntermetallic compoundsThermal cyclingGrowth of interfacial intermetallic compoundsDecreased shear strengthGrowth of intermetallic compoundsInterfacial intermetallic growthGrowth rate of interfacial intermetallic compoundsNanocomposite solderReinforcement particlesComposite solderBrittle intermetallicsSacrificial elementsImproved wettabilityCobalt nanoparticlesImprovement extentSolder/Cu interfaceSolderIntermetallic growthAdditive amountJoint showWettability
This site is protected by hCaptcha and its Privacy Policy and Terms of Service apply