Effects of nano-SiO2 particles addition on the microstructure, wettability, joint shear force and the interfacial IMC growth of Sn3.0Ag0.5Cu solder
Wang Y, Zhao X, Xie X, Gu Y, Liu Y. Effects of nano-SiO2 particles addition on the microstructure, wettability, joint shear force and the interfacial IMC growth of Sn3.0Ag0.5Cu solder. Journal Of Materials Science: Materials In Electronics 2015, 26: 9387-9395. DOI: 10.1007/s10854-015-3151-8.Peer-Reviewed Original ResearchInterfacial intermetallic compoundsJoint shear forceNano-SiO2 particlesSiO2 nanoparticlesNano-SiO2Composite solderShear forceInterfacial IMCsThermal cyclingGrowth of interfacial intermetallic compoundsComposite solder jointsInterfacial IMCs formationNano-composite soldersConcentration of SiO2 nanoparticlesInterfacial IMC layerInterfacial IMC growthEffect of SiO2Solder jointsIMC layerSolder alloysHigh shear forcesIMC formationParticle additionOptimum additive concentrationWorking temperatureEffects of Cobalt Nanoparticles Addition on Shear Strength, Wettability and Interfacial Intermetallic Growth of Sn−3.0Ag−0.5Cu Solder during Thermal Cycling
Gu Y, Liu Y, Zhao X, Wen S, Li H, Wang Y. Effects of Cobalt Nanoparticles Addition on Shear Strength, Wettability and Interfacial Intermetallic Growth of Sn−3.0Ag−0.5Cu Solder during Thermal Cycling. Materials Science Forum 2015, 815: 97-102. DOI: 10.4028/www.scientific.net/msf.815.97.Peer-Reviewed Original ResearchShear strengthInterfacial intermetallic compoundsCo nanoparticlesNanoparticle additionIntermetallic compoundsThermal cyclingGrowth of interfacial intermetallic compoundsDecreased shear strengthGrowth of intermetallic compoundsInterfacial intermetallic growthGrowth rate of interfacial intermetallic compoundsNanocomposite solderReinforcement particlesComposite solderBrittle intermetallicsSacrificial elementsImproved wettabilityCobalt nanoparticlesImprovement extentSolder/Cu interfaceSolderIntermetallic growthAdditive amountJoint showWettability
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