Effects of nano-SiO2 particles addition on the microstructure, wettability, joint shear force and the interfacial IMC growth of Sn3.0Ag0.5Cu solder
Wang Y, Zhao X, Xie X, Gu Y, Liu Y. Effects of nano-SiO2 particles addition on the microstructure, wettability, joint shear force and the interfacial IMC growth of Sn3.0Ag0.5Cu solder. Journal Of Materials Science: Materials In Electronics 2015, 26: 9387-9395. DOI: 10.1007/s10854-015-3151-8.Peer-Reviewed Original ResearchInterfacial intermetallic compoundsJoint shear forceNano-SiO2 particlesSiO2 nanoparticlesNano-SiO2Composite solderShear forceInterfacial IMCsThermal cyclingGrowth of interfacial intermetallic compoundsComposite solder jointsInterfacial IMCs formationNano-composite soldersConcentration of SiO2 nanoparticlesInterfacial IMC layerInterfacial IMC growthEffect of SiO2Solder jointsIMC layerSolder alloysHigh shear forcesIMC formationParticle additionOptimum additive concentrationWorking temperature
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