Reliability enhancement of Sn-1.0Ag-0.5Cu nano-composite solders by adding multiple sizes of TiO2 nanoparticles
Wen Y, Zhao X, Chen Z, Gu Y, Wang Y, Chen Z, Wang X. Reliability enhancement of Sn-1.0Ag-0.5Cu nano-composite solders by adding multiple sizes of TiO2 nanoparticles. Journal Of Alloys And Compounds 2017, 696: 799-807. DOI: 10.1016/j.jallcom.2016.12.037.Peer-Reviewed Original ResearchNano‐composite solder jointsNano-composite soldersSolder jointsTiO2 nanoparticlesThermal cyclingShear strengthCoefficient of thermal expansion reductionInterfacial intermetallic compound growthSize of TiO2 nanoparticlesComposite solder alloysSAC105 solder jointsCoefficient of thermal expansionShear strength enhancementIntermetallic compound growthInterfacial intermetallic compound formationElectrical resistance changeIntermetallic compound formationMicrostructural refinementStrength enhancementDecreased CTESolder alloysElectrical reliabilitySolderReliability enhancementTiO2
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