Emily R. Kinser

Emily R. Kinser earned both her B.S.(2004) & M.S.(2005) in Materials Science and Engineering, and a B.A.(2004) in Political Science from Iowa State University. She joined IBM in 2005 in the Microelectronics Division at the 300mm wafer fab in Fishkill, NY as a dielectric thin films process engineer in the manufacturing organization, later joining the IBM Semiconductor Research & Development Center (SRDC) in 2007 working as an integration engineer on the Far Back End of Line Integration (FBEOL) and 3D Systems Integration teams. In 2009 Emily became part of the SRDC Competitive Analysis & Technology Strategy team. From 2014 – 2016, Emily reported to IBM Corporate Headquarters working as a patent engineer in the IP Licensing and Development team, where she focused on IBM’s semiconductor and storage-related IP portfolios. Beginning in January 2016, Emily began an assignment as the Global Technology Outlook 2017 Co-Lead for IBM Research at the Thomas J. Watson Research Center in Yorktown Heights, NY.

Emily’s innovations have resulted in 34 filed US patent applications, including 29 issued US Patents, to date. She and her mentor won the 2007 IBM Women Inventor’s Network Patent Challenge grand prize for an invention that enabled improved packaging of chips with lead-free solder. In 2009 Emily was selected as a participant in the prestigious IBM Corporate Services Corps program as a member of Egypt Team 2, deployed in Luxor, Egypt. Emily also has provided IP mentoring for 11 other IBMers, as well as extensive external mentoring. In October 2015, Emily was honored with the distinction of “Master Inventor” for the IBM CIO/CHQ organization.

In Fall 2011 Emily began pursuing her PhD at Yale University in Mechanical Engineering & Materials Science, sponsored by IBM. She earned her M.S. & M.Phil. in December 2014, with her dissertation research focused on surface engineering for novel biomaterials and next generation biosensors.